Rambus Inc. (NASDAQ:RMBS):
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Who:
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Rambus Inc. (NASDAQ: RMBS)
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Where:
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Denali MemCon 2008
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Hyatt Regency
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5101 Great America Parkway
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Santa Clara, CA
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Booth #14
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When:
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July 21-24, 2008
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Join Rambus at MemCon 2008 for demos, displays, and presentations of
our latest technology developments.
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Rambus Presentations:
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Wednesday, July 23, 10:30 AM PDT
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Title: The Next Generation of Mobile Memory
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Presented by: Judy Chen, Ph.D., Strategic Marketing Manger and
Fredrick Ware, Technical Director at Rambus
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Main Presentation Hall, Ballrooms E-H
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Thursday, July 24, 9:45 AM PT
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Title: Memory System Challenges in the MultiCore Era
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Presented by: Steven Woo, Ph.D., Technical Director
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Main Presentation Hall, Ballrooms E-H
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Rambus Booth Demonstrations:
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The Terabyte Bandwidth Initiative, featuring new memory signaling
innovations that facilitate data rates of 16Gbps and a future memory
architecture that can deliver an unprecedented terabyte per second
(TB/s) of memory bandwidth (1 terabyte = 1,024 gigabytes) to a single
System-on-Chip (SoC). Innovations include the industry’s
first differential signaling for both data and command/address (C/A);
FlexLink™ C/A, the
industry’s first full-speed, point-to-point
C/A link; and 32X Data Rate technology (32 data bits per input clock
cycle).
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The award-winning XDR™
memory architecture: a low-cost XDR system solution operating at
3.2Gbps data rate, on a two-layer printed circuit board. The test
board shows a Rambus XDR PHY and memory controller interfacing to an
XDR DRAM.
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A PLAYSTATION®3 (PS3™)
Open Demo Board featuring XDR technology. The Rambus XDR memory
interface and FlexIO™
processor bus enable an unprecedented aggregate bandwidth of over 90
gigabytes-per-second between the Cell Broadband Engine and supporting
chips at the heart of the PS3.
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TI DLP Open Demo Board: Rambus is showing an open TI DLP projector
development board, highlighting Rambus XDR technology inside. The
development board includes a 4.0Gbps, 16-bit XDR interface, an XDR
Memory Controller (XMC), XDR memory cell interface (XIO), XDR DRAM,
and the XDR Clock Generator (XCG). XDR has been adopted by TI for use
in their DLP graphics engines, targeted at consumer projectors. TI DLP
technology, included in Sharp projectors, is one of many
consumer-level applications taking advantage of the XDR memory
architecture.
For registration and additional information, please visit http://www.denali.com/memcon
About Rambus, Inc.
Rambus is one of the world's premier technology licensing companies
specializing in the invention and design of high-speed memory
architectures. Since its founding in 1990, the Company's patented
innovations, breakthrough technologies and renowned integration
expertise have helped industry-leading chip and system companies bring
superior products to market. Rambus' technology and products solve
customers' most complex chip and system-level interface challenges
enabling unprecedented performance in computing, communications and
consumer electronics applications. Rambus licenses both its world-class
patent portfolio as well as its family of leadership and
industry-standard interface products. Headquartered in Los Altos,
California, Rambus has regional offices in North Carolina, India,
Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR,
FlexPhase and FlexLink are trademarks of Rambus Inc. All other trade
names are the service marks, trademarks, or registered trademarks of
their respective owners.
Rambus Public Relations
Linda Ashmore, 650-947-5411
lashmore@rambus.com
or
Citigate
Cunningham for Rambus
Lisa Kennedy, 415-618-8726
lkennedy@citigatecunningham.com
