TC-5688 Demonstrates Excellent Thermal Performance and Exceptional Resistance to Pump-Out in New Processor
MIDLAND, Mich., Aug. 19 /PRNewswire-FirstCall/ -- Dow Corning
Corporation's Electronics group today announced the immediate availability of
DOW CORNING(R) TC-5688 Thermally Conductive Compound - an
ultra-high-performance, non-curing thermal grease developed for use with Intel
Corp.'s newest mobile microprocessor - Intel(R) Core(R)2 Extreme mobile
processor QX9300.
The DOW CORNING(R) TC-5688 Thermally Conductive Compound and a variety of
competitor thermal interface materials (TIMs) were subjected to extensive
thermal stress evaluation with the Quad-Core mobile tester and live Intel(R)
Core(R)2 Extreme mobile processor QX9300 testing. Dow Corning's new thermal
grease demonstrated the best initial thermal-resistance values of any
competitor TIM tested on the Quad-Core mobile tester as well as exceptional
resistance to pump-out, the tendency of some TIMs to migrate from their usage
area after repeated thermal-expansion cycles, resulting in decreased
performance. TC-5688 was the only thermal grease compound tested to exhibit
sufficient reliability after repeated power cycling, while other thermal
greases suffered severe degradation.
TC-5688 offers extremely low thermal resistance at 0.05 degrees C-cm(2)/W
and a high level of thermal conductivity at 5.67 W/mK. It excels in real-world
applications involving non-uniform substrates and varying bond line
thicknesses. TC-5688 is also suitable for cooling other Intel processors and
in a wide array of non-computing areas - including power, industrial and
light-emitting diode (LED) applications - where high-performance, highly
reliable thermal materials are required.
'Thermal greases are the preferred form of TIM for most computer
assemblers because of their excellent thermal performance, low cost and ease
of processing,' said Andrew Lovell from Dow Corning's Thermal Materials Group.
'We are very excited about the outstanding performance of our newest thermal
grease developed for Intel(R) Core(R)2 Extreme mobile processor QX9300. We
have been developing a broad portfolio of thermal materials in recent years,
and the cutting-edge, market-leading capabilities of TC-5688 significantly
strengthen our product offerings for the rapidly growing mobile PC market.'
Market researchers expect laptop computer shipments to reach 125 million
in 2008 and to surpass desktop sales during 2010. TC-5688 is the ideal thermal
material for this growing market since it provides excellent thermal
performance and the highest reliability for the bare die processors used in
laptop computers.
PC manufacturers use TIMs to carry heat away from microprocessors,
graphics processors and other critical components, typically by applying a
thin layer of the compound between a chip and a heat sink. Other emerging
thermal materials markets include LEDs, flat-panel displays and a variety of
communication and automotive products.
Dow Corning Electronics offers global technical support for the new
material. Dow Corning's Electronics group serves the needs of the electronics,
optoelectronics and semiconductor industries with specialized, high-purity
silicone- and silicon-containing products and solutions.
For more information on Dow Corning Electronics' full range of thermal
management materials, visit www.dowcorning.com/electronics.
About Dow Corning
Dow Corning Corporation is a globally integrated provider of materials,
application technology and services, and is focused on providing innovative
technologies that help its customers to invent the future. For more
information on Dow Corning, visit http://www.dowcorning.com. Dow Corning
Corporation is equally owned by The Dow Chemical Company (NYSE: DOW) and
Corning Incorporated (NYSE: GLW). More than half of Dow Corning Corporation's
sales are outside the United States.
SOURCE Dow Corning Electronics
